This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels ...
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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow's 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
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Add this copy of 3d Interconnect Architectures for Heterogeneous to cart. $95.63, new condition, Sold by Books International rated 4.0 out of 5 stars, ships from Toronto, ON, CANADA, published 2023 by Springer Nature Switzerland AG.
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New. Print on demand Contains: Illustrations, black & white, Illustrations, color. XXV, 395 p. 102 illus., 100 illus. in color. Intended for professional and scholarly audience.
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Seller's Description:
New. Contains: Illustrations, black & white, Illustrations, color. XXV, 395 p. 102 illus., 100 illus. in color. Intended for professional and scholarly audience.
Add this copy of 3D Interconnect Architectures for Heterogeneous to cart. $146.05, new condition, Sold by Ria Christie Books rated 4.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2022 by Springer Nature Switzerland AG.
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Seller's Description:
New. Contains: Illustrations, black & white, Illustrations, color. XXV, 395 p. 102 illus., 100 illus. in color. Intended for professional and scholarly audience.
Add this copy of 3d Interconnect Architectures for Heterogeneous to cart. $197.68, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2022 by Springer.
