This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.
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This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.
Read Less
Add this copy of Area Array Packaging Processes to cart. $55.20, new condition, Sold by Media Smart rated 4.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 2003 by The McGraw-Hill Company.
Add this copy of Area Array Packaging Processes: for Bga, Flip Chip, and to cart. $111.45, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 2003 by McGraw-Hill Professional Publishing.
Add this copy of Area Array Packaging Processes to cart. $137.15, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Packaging Processes to cart. $141.92, new condition, Sold by Ria Christie Books rated 4.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2003 by McGraw-Hill Professional.
Add this copy of Area Array Packaging Processes to cart. $148.67, new condition, Sold by Paperbackshop rated 4.0 out of 5 stars, ships from Bensenville, IL, UNITED STATES, published 2003 by McGraw-Hill Education LLC (Professional Pod).
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