Distributed Applications and Interoperable Systems: 22nd IFIP WG 6.1 International Conference, DAIS 2022, Held as Part of the 17th International Federated Conference on Distributed Computing Techniques, DisCoTec 2022, Lucca, Italy, June 13-17, 2022...
This book constitutes the refereed proceedings of the 22nd IFIP WG 6.1 International Conference on Distributed Applications and Interoperable Systems, DAIS 2022, held in Lucca, Italy, in June 2022, as part of the 17th International Federated Conference on Distributed Computing Techniques, DisCoTec 2022. The 9 full papers and 2 short papers presented in this book were carefully reviewed and selected from 19 submissions. DAIS addresses all practical and conceptual aspects of distributed applications, including their design, ...
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This book constitutes the refereed proceedings of the 22nd IFIP WG 6.1 International Conference on Distributed Applications and Interoperable Systems, DAIS 2022, held in Lucca, Italy, in June 2022, as part of the 17th International Federated Conference on Distributed Computing Techniques, DisCoTec 2022. The 9 full papers and 2 short papers presented in this book were carefully reviewed and selected from 19 submissions. DAIS addresses all practical and conceptual aspects of distributed applications, including their design, modeling, implementation and operation, the supporting middleware, appropriate software engineering methodologies and tools, as well as experimental studies and applications.
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Add this copy of Distributed Applications and Interoperable Systems: to cart. $51.65, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2022 by Springer International Publishing AG.
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New. Print on demand Contains: Illustrations, black & white, Illustrations, color. Lecture Notes in Computer Science . XII, 201 p. 57 illus., 55 illus. in color. Intended for professional and scholarly audience.
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New. Contains: Illustrations, black & white, Illustrations, color. Lecture Notes in Computer Science . XII, 201 p. 57 illus., 55 illus. in color. Intended for professional and scholarly audience.