Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design ...
Read More
Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Read Less
Add this copy of Hybrid Assemblies and Multichip Modules to cart. $39.00, like new condition, Sold by ThriftBooks-Atlanta rated 5.0 out of 5 stars, ships from Austell, GA, UNITED STATES, published 1992 by CRC Press.
Add this copy of Hybrid Assemblies and Multichip Modules (Manufacturing to cart. $39.02, very good condition, Sold by GuthrieBooks rated 5.0 out of 5 stars, ships from Spring Branch, TX, UNITED STATES, published 1992 by CRC Press.
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
Very Good. Size: 11x0x8; Ex-Library hardcover in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
Add this copy of Hybrid Assemblies and Multichip Modules to cart. $45.56, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 1992 by CRC Press.
Add this copy of Hybrid Assemblies and Multichip Modules to cart. $58.25, new condition, Sold by Media Smart rated 4.0 out of 5 stars, ships from Hawthorne, CA, UNITED STATES, published 1992 by Taylor & Francis Group.
Add this copy of Hybrid Assemblies and Multichip Modules (Manufacturing to cart. $77.99, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1992 by CRC Press.
Add this copy of Hybrid Assemblies and Multichip Modules to cart. $95.87, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 1992 by CRC Press.
Add this copy of Hybrid Assemblies and Multichip Modules to cart. $140.44, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 1992 by CRC Press.
Add this copy of Hybrid Assemblies and Multichip Modules to cart. $146.38, new condition, Sold by discount_scientific_books rated 5.0 out of 5 stars, ships from Sterling Heights, MI, UNITED STATES, published 1992 by CRC Press.
