Reviewing various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a ...
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Reviewing various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book details available packaging approaches: single chip, multichip, and Chip On Board; the assembly options, chip and wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.
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Add this copy of Integrated Circuit Packaging, Assembly and to cart. $53.98, good condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 2010 by Springer.
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Add this copy of Integrated Circuit Packaging, Assembly and to cart. $70.21, very good condition, Sold by Zubal Books rated 4.0 out of 5 stars, ships from Cleveland, OH, UNITED STATES, published 2010 by Springer.
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328 pp., paperback, light wear to covers else very good. -If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Add this copy of Integrated Circuit Packaging, Assembly and to cart. $79.95, very good condition, Sold by Salish Sea Books rated 4.0 out of 5 stars, ships from Bellingham, WA, UNITED STATES, published 2007 by Springer-Verlag Publishing.
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Very Good+; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are bright and unmarked; The binding is tight with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5"-9.75" tall); 1.4 lbs; Red covers with title in white lettering; 2007, Springer-Verlag Publishing; 300 pages; "Integrated Circuit Packaging, Assembly and Interconnections (Springer Series in Advanced Microelectronics), " by William Greig.
Add this copy of Integrated Circuit Packaging, Assembly and to cart. $103.32, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2007 by Springer.
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