Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems ...
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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool- ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
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Add this copy of Microelectronics Packaging Handbook: Semiconductor to cart. $49.07, good condition, Sold by Anybook rated 4.0 out of 5 stars, ships from Lincoln, UNITED KINGDOM, published 1997 by Chapman & Hall.
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Seller's Description:
Volume 2. This is an ex-library book and may have the usual library/used-book markings inside. This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item, 1650grams, ISBN: 9780412084416.
Add this copy of Microelectronics Packaging Handbook, Part 2: to cart. $73.63, fair condition, Sold by 2nd Life Books rated 4.0 out of 5 stars, ships from Burlington, NJ, UNITED STATES, published 1997 by Springer.
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Fair. A readable copy. All pages are intact and the cover is intact. Dust jacket may be missing. Pages can include considerable highlighting markings writing but cannot obscure the text. May be an Ex-lib. copy and have standard library stamps and or stickers. May NOT include discs or access code or other supplemental material. We ship Monday-Saturday and respond to inquiries within 24 hours.
Add this copy of Microelectronics Packaging Handbook, Part II: to cart. $100.00, good condition, Sold by Moe's Books rated 4.0 out of 5 stars, ships from Berkeley, CA, UNITED STATES, published 1997 by Chapman & Hall.
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Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
Add this copy of Microelectronics Packaging Handbook, Part 2: to cart. $124.95, good condition, Sold by Salish Sea Books rated 4.0 out of 5 stars, ships from Bellingham, WA, UNITED STATES, published 1997 by Springer-Verlag Publishing.
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Good+; Hardcover; Former corporate library copy with company stamp to the right textblock edge, inside each cover, and to the first and last endpapers; Covers are clean and glossy; Text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5"-9.75" tall); Purple and orange covers with title in white and yellow lettering; 2nd Edition; 1997, Springer-Verlag Publishing; 1030 pages; "Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging, " by R.R. Tummala, et al.
Add this copy of Microelectronics Packaging Handbook, Part 2: to cart. $187.20, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1997 by Springer.
Add this copy of Microelectronics Packaging Handbook, Part 2: to cart. $283.72, new condition, Sold by GridFreed rated 5.0 out of 5 stars, ships from North Las Vegas, NV, UNITED STATES, published 1997 by Springer.
Add this copy of Microelectronics Packaging Handbook: Semiconductor to cart. $356.96, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 1997 by Springer.
Add this copy of Microelectronics Packaging Handbook: Semiconductor to cart. $418.18, new condition, Sold by Ria Christie Books rated 4.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 1997 by Springer.
Add this copy of Microelectronics Packaging Handbook, Part 2: to cart. $451.59, new condition, Sold by Just one more Chapter rated 3.0 out of 5 stars, ships from Miramar, FL, UNITED STATES, published 1997 by Springer.
