RF and Microwave Microelectronics Packaging

This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields. Read More

This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields. Read Less

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  	This is a digital edition of this title. Rent eBook (5 Options) 30 Day Rental: $47.70 (Expires Jun 16, 2025) 60 Day Rental: $63.60 (Expires Jul 16, 2025) 90 Day Rental: $79.50 (Expires Aug 15, 2025) 120 Day Rental: $95.40 (Expires Sep 14, 2025) 180 Day Rental: $103.35 (Expires Nov 13, 2025) Buy eBook Lifetime Access: $159.00 Title: Rf and Microwave Microelectronics Packaging by Ken Kuang; Âfranklin Kim; Âsean S. Cahill Publisher: Springer Nature Print ISBN: 9781441909831, 1441909834 eText ISBN: 9781441909848 Edition: 2009 1st edition Format: EPUB eBook	$47.70 Rent eBook This is a digital eBook Nothing will be shipped to you Works with web browsers and the VitalSource app on all Windows, Mac, Chromebook, Kindle Fire, iOS, and Android devices Most eBooks are returnable within 14 days of purchase Questions? See our eBook FAQ