RF and Microwave Module Level Design and Integration presents a thorough introduction to the basic elements of radio frequency (RF) and microwave modules, followed by a discussion of system-level concepts and measures that can be applied to real-world designs. With a strong emphasis on design and integration, the book offers practical solutions to today's commonly encountered challenges in RF and microwave modules, including system integration, network loss reduction techniques, electromagnetic compatibility, crosstalk ...
Read More
RF and Microwave Module Level Design and Integration presents a thorough introduction to the basic elements of radio frequency (RF) and microwave modules, followed by a discussion of system-level concepts and measures that can be applied to real-world designs. With a strong emphasis on design and integration, the book offers practical solutions to today's commonly encountered challenges in RF and microwave modules, including system integration, network loss reduction techniques, electromagnetic compatibility, crosstalk reduction techniques, computer-aided design tools, system-level modeling methodologies, and system-level performance evaluation via common RF measurements. Several design examples are presented across the book chapters. This book describes techniques for the design and development of today's complex (multi-chip) radio frequency and microwave modules for an audience of engineers in academia and industry, and advanced students focusing on RF and microwave module design and integration.
Read Less
Add this copy of RF and Microwave Module Level Design and Integration to cart. $118.10, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2019 by Institution of Engineering and Technology.
Publisher:
Institution of Engineering and Technology
Published:
2019
Alibris ID:
15584054479
Shipping Options:
Standard Shipping: $4.99
Trackable Expedited: $9.99
Two Day Air: $29.99
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. Print on demand 336 p. Materials, Circuits and Devices . Intended for professional and scholarly audience. Intended for college/higher education audience.
Add this copy of RF and Microwave Module Level Design and Integration to cart. $173.69, new condition, Sold by GreatBookPrices rated 4.0 out of 5 stars, ships from Columbia, MD, UNITED STATES, published 2019 by Institution of Engineering and Technology.
Publisher:
Institution of Engineering and Technology
Published:
2019
Alibris ID:
18042233556
Shipping Options:
Standard Shipping: $4.99
Choose your shipping method in Checkout. Costs may vary based on destination.
Seller's Description:
New. 336 p. Materials, Circuits and Devices . Intended for professional and scholarly audience. Intended for college/higher education audience. In Stock. 100% Money Back Guarantee. Brand New, Perfect Condition, allow 4-14 business days for standard shipping. To Alaska, Hawaii, U.S. protectorate, P.O. box, and APO/FPO addresses allow 4-28 business days for Standard shipping. No expedited shipping. All orders placed with expedited shipping will be cancelled. Over 3, 000, 000 happy customers.
Add this copy of RF and Microwave Module Level Design and Integration to cart. $173.70, new condition, Sold by Ria Christie Books rated 4.0 out of 5 stars, ships from Uxbridge, MIDDLESEX, UNITED KINGDOM, published 2019 by Institution of Engineering and Technology.
Add this copy of RF and Microwave Module Level Design and Integration to cart. $194.86, new condition, Sold by Booksplease rated 4.0 out of 5 stars, ships from Southport, MERSEYSIDE, UNITED KINGDOM, published 2019 by Institution of Engineering and Technology.