Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
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Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. This is a reference on wire bonding. It emphasis on fine pitch bonding, bonding to MCMs, and additional areas.
Read Less
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. $39.34, good condition, Sold by Books From California rated 4.0 out of 5 stars, ships from Simi Valley, CA, UNITED STATES, published 1997 by McGraw-Hill Professional.
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. $210.72, good condition, Sold by HPB-Red rated 5.0 out of 5 stars, ships from Dallas, TX, UNITED STATES, published 1997 by McGraw-Hill Professional.
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Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Add this copy of Wire Bonding in Microelectronics: Materials, Processes, to cart. $258.54, good condition, Sold by BooksRun rated 4.0 out of 5 stars, ships from Philadelphia, PA, UNITED STATES, published 1997 by McGraw-Hill Professional.
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Seller's Description:
It's a preowned item in good condition and includes all the pages. It may have some general signs of wear and tear, such as markings, highlighting, slight damage to the cover, minimal wear to the binding, etc., but they will not affect the overall reading experience.
