One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is ...
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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech- nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo- dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation- ships between these characteristics are clearly explained and pre- sented. In this excellent presentation, Dr. Hwang highlights three impor- tant areas of solder paste technology.
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Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $16.00, very good condition, Sold by Tiber Books rated 4.0 out of 5 stars, ships from Cockeysville, MD, UNITED STATES, published 1989 by Van Nostrand Reinhold, NY.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $17.82, very good condition, Sold by GuthrieBooks rated 5.0 out of 5 stars, ships from Spring Branch, TX, UNITED STATES, published 1989 by Van Nostrand Reinhold Company.
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Very Good. Size: 9x6x1; Ex-Library hardcover with dj in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $17.82, good condition, Sold by Bookmans rated 5.0 out of 5 stars, ships from Tucson, AZ, UNITED STATES, published 1989 by Van Nostrand Reinhold Company.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $43.00, very good condition, Sold by Clausen Books, RMABA rated 4.0 out of 5 stars, ships from Colorado Springs, CO, UNITED STATES, published 1981 by Van Nostrand Reinhold.
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Photographs/Graphs/Charts/Folded Maps/Rear Pocket Map. Very Good in Very Good (in mylar) jacket. Hardcover. 8vo-over 7¾"-9¾" tall. Textblock and binding is clean and tight. Unclipped dust jacket with light loss to extremities, some creases. 456p., including index.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $49.78, good condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1989 by Van Nostrand Reinhold Company.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $67.00, like new condition, Sold by BingoBooks2 rated 4.0 out of 5 stars, ships from Vancouver, WA, UNITED STATES, published 1989 by Florence, Kentucky, U.S.A. : Van Nostrand Reinhold.
Add this copy of Solder Paste in Electronics Packaging: Technology and to cart. $69.27, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 1989 by Van Nostrand Reinhold Company.
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Fine in Fine dust jacket. Excellent as new condition, perfect mint. A brand new copy in a very good DJ. Unknown printing. xxii, 456 p. : ill. ; 24 cm. Includes bibliographies and index.
