This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
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This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
Read Less
Add this copy of Introduction to Microelectronics Advanced Packaging to cart. $51.65, new condition, Sold by Ingram Customer Returns Center rated 5.0 out of 5 stars, ships from NV, USA, published 2025 by Springer International Publishing AG.
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New. Print on demand Contains: Illustrations, black & white, Illustrations, color. Synthesis Lectures on Engineering, Science, and Technology . XIX, 183 p. 45 illus., 43 illus. in color. Intended for professional and scholarly audience.
Add this copy of Introduction to Microelectronics Advanced Packaging to cart. $120.60, new condition, Sold by Bonita rated 4.0 out of 5 stars, ships from Santa Clarita, CA, UNITED STATES, published 2025 by Springer.
