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Additional copies that match your search:
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1. Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic Components
by Sapatnekar, Sachin, and Srivastava, Ankur, and Zhang, Yufu
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 212 p. See More Details
2014, World Scientific Publishing Company
ISBN-13: 9789814583435
Hardcover, New
NV, USA
$235.79
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2. Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic Components
by Sapatnekar, Sachin, and Srivastava, Ankur, and Zhang, Yufu
Seller Description: New. Sewn binding. Cloth over boards. 212 p. See More Details
2014, World Scientific Publishing Company
ISBN-13: 9789814583435
Hardcover, New
Southport, MERSEYSIDE, UNITED KINGDOM
$282.43