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1. Materials for Information Technology: Devices, Interconnects and Packaging
by Zschech, Ehrenfried (Editor), and Whelan, Caroline (Editor), and Mikolajick, Thomas (Editor)
Seller Description: New. Print on demand Engineering Materials and Processes . XIX, 508 p. Intended for professional and scholarly audience. See More Details
2010, Springer London Ltd
ISBN-13: 9781849969673
Paperback, New
NV, USA
$205.73
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2. Materials for Information Technology: Devices, Interconnects and Packaging
by Zschech, Ehrenfried (Editor), and Whelan, Caroline (Editor), and Mikolajick, Thomas (Editor)
Seller Description: New. Print on demand Sewn binding. Cloth over boards. 508 p. Contains: Unspecified, Tables, black & white. Engineering Materials and Processes. See More Details
2005, Springer
ISBN-13: 9781852339418
Hardcover, New
NV, USA
$206.66
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3. Materials for Information Technology
by Ehrenfried Zschech; Ācaroline Whelan; Āthomas Mikolajick
eBook See More Details
Springer Nature
eBook ISBN: 9781852339418
Edition: 1st edition
Format: PDF eBook
Digital download
$209.00
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4. Advanced Interconnects for Ulsi Technology Format: Hardcover
by Mikhail Baklanov (Imec); Paul S. Ho (University Of Texas At Austin); Ehrenfried Zschech (Fraunhofer Inst. For Non-Destr....
Seller Description: BRAND NEW. 9780470662540. See More Details
ISBN-13: 9780470662540
Avenel, NJ, USA
$217.38
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5. Materials for Information Technology: Devices, Interconnects and Packaging
by Zschech, Ehrenfried (Editor), and Whelan, Caroline (Editor), and Mikolajick, Thomas (Editor)
Seller Description: New. Sewn binding. Cloth over boards. 508 p. Contains: Unspecified, Tables, black & white. Engineering Materials and Processes. See More Details
2005, Springer
ISBN-13: 9781852339418
Hardcover, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$252.31
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6. Materials for Information Technology: Devices, Interconnects and Packaging
by Zschech, Ehrenfried (Editor), and Whelan, Caroline (Editor), and Mikolajick, Thomas (Editor)
Seller Description: New. Engineering Materials and Processes . XIX, 508 p. Intended for professional and scholarly audience. See More Details
2010, Springer London Ltd
ISBN-13: 9781849969673
Paperback, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$252.31
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7. Advanced Interconnects for Ulsi Technology
by . Ed(S): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried
Seller Description: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in ... See More Details
ISBN-13: 9780470662540
Galway, IRELAND
$314.23
