3D Ic Devices, Technologies,...
Hong Xiao
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Physical Design for 3D...
Aida Todri-Sanial (Editor),
Chuan Seng Tan (Editor)
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Vertical 3D Memory...
Betty Prince
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3D IC Integration and...
John Lau
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Three-Dimensional Integrated...
Vasilis F Pavlidis,
Ioannis Savidis
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Through-Silicon Vias for 3D...
John H Lau
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Design of 3D Integrated...
Rohit Sharma (Editor)
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Through Silicon Vias:...
Brajesh Kumar Kaushik,
Vobulapuram Ramesh Kumar
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Power, Thermal, Noise, and...
Yue Ma,
Christian Gontrand
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Advances In 3d Integrated...
Hao Yu,
Chuan Seng Tan
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3D Integration in VLSI...
Katsuyuki Sakuma (Editor)
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Electrical Modeling and...
Er-Ping Li
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Designing Tsvs for 3D...
Nauman Khan,
Soha Hassoun
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Semiconducting Black...
Han Zhang, (Se,
Nasir Mahmood Abbasi
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Three-Dimensional Integrated...
Vasilis F Pavlidis,
Eby G Friedman
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3D Integration of Resistive...
Qing Luo (Editor)
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Wireless Interface...
Tadahiro Kuroda,
Wai-Yeung Yip
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3D IC Stacking Technology
Banqiu Wu,
Ajay Kumar
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Arbitrary Modeling of TSVs...
Khaled Salah,
Yehea Ismail
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