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Additional copies that match your search:
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1. 3D Microelectronic Packaging: From Architectures to Applications
by Li, Yan (Editor), and Goyal, Deepak (Editor)
Seller Description: New. Sewn binding. Cloth over boards. 622 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color, Tables, color. Springer Advanced Microelectronics, 64. See More Details
2020, Springer
ISBN-13: 9789811570896
Hardcover, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$210.83
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2. 3D Microelectronic Packaging: From Fundamentals to Applications
by Li, Yan (Editor), and Goyal, Deepak (Editor)
Seller Description: New. Trade paperback (US). Glued binding. 463 p. Contains: Unspecified, Illustrations, black & white, Illustrations, color. Springer Advanced Microelectronics, 57. See More Details
2018, Springer
ISBN-13: 9783319830865
Trade paperback, New
Uxbridge, MIDDLESEX, UNITED KINGDOM
$239.52