• 

  Electromigration in Metals: Fundamentals to Nano-Interconnects

  by Paul S. Ho, Chao-Kun Hu, Martin Gall

  • See All from $96.73
  • New from $96.73
  • eBook from $80.00
  • Collectible from $134.88
  • Eligible for FREE Shipping
  • More Books Like This | Add to Wishlist

  Recommended Copy

  $96.73

  New Hardcover, 2022

  More details Add to Cart
• 

  Low Dielectric Constant Materials for IC Applications

  by Paul S. Ho (Editor), Jihperng Leu (Editor), Wei William Lee (Editor)

  • See All from $132.68
  • New from $159.69
  • eBook from $47.70
  • Collectible from $206.11
  • Eligible for FREE Shipping
  • More Books Like This | Add to Wishlist

  Recommended Copy

  $159.69

  New Softcover, 2012

  More details Add to Cart
• 

  Advanced Interconnects for ULSI Technology

  by Mikhail Baklanov (Editor), Paul S. Ho (Editor), Ehrenfried Zschech (Editor)

  • See All from $158.94
  • New from $177.55
  • More Books Like This | Add to Wishlist
• 

  Materials Reliability Issues in Microelectronics: Volume 225

  by James R. Lloyd (Editor), Frederick G. Yost (Editor), Paul S. Ho (Editor)

  • See All from $10.41
  • Collectible from $40.95
  • More Books Like This | Add to Wishlist

  Recommended Copy

  $10.41

  Used Hardcover, 1991

  More details Add to Cart
• 

  Stress-Induced Phenomena in Metallization: Proceedings of the Second International Workshop Held in Austin, Texas, March 1993

  by Paul Totta, Paul S Ho (Editor), Paul Tuha (Editor)

  • See All from $4.74
  • Collectible from $45.31
  • More Books Like This | Add to Wishlist
• 

  Electronic Packaging Materials Science V: Volume 203

  by Edwin D. Lillie (Editor), Paul S. Ho (Editor), Ralph Jaccodine (Editor)

  • See All from $49.80
  • More Books Like This | Add to Wishlist

  Recommended Copy

  $49.80

  Used Hardcover, 1991

  More details Add to Cart

Additional copies that match your search:

• 1. Advanced Interconnects for Ulsi Technology Format: Hardcover

  by Mikhail Baklanov (Imec); Paul S. Ho (University Of Texas At Austin); Ehrenfried Zschech (Fraunhofer Inst. For Non-Destr....

   
  

  

  Seller Description: BRAND NEW. 9780470662540. See More Details

  ISBN-13: 9780470662540 New

  indoo HIGH Avenel, NJ, USA

  $217.38 Add to Cart

  Add to Wishlist

• 2. Advanced Interconnects for Ulsi Technology

  by . Ed(S): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried

   
  

  

  Seller Description: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in ... See More Details

  ISBN-13: 9780470662540 New

  Kennys.ie HIGH Galway, IRELAND

  $314.23 Add to Cart

  Add to Wishlist